Commonly used process for the preparation of diamond films cvd DC plasma jet method. The diamond deposition to wc + co alloy (mirror-finished surface), and in the cooling process of the substrate, the diamond film off automatically. This method of deposition speed (up to 930μm / h), binding between the lattice more closely, but the growth surface is rough. Diamond film of high hardness, wear resistance, non-conductive determines its cutting method is laser cutting (cutting can be carried out in air, oxygen and argon environment). Laser cut diamond thick film can not only cut to desired shape and size, but also can be cut out after the angle of the tool, with a narrow kerf, high efficiency and other advantages.

Diamond Thick Film Cutters Welding

Having between diamond and general metal and its alloys high interfacial energy, resulting in diamond can not be generally low melting point alloy infiltration, weldability is poor. At present, the addition of a strong carbide-forming elements or by diamond surface metallization process to improve the diamond and the metal between solderability of copper silver alloy solder.